Substrate warping detection mechanism for partial soldering equipment
Even if warping occurs in the substrate, soldering can be done by offsetting the amount of warping.
- Measure the distance to any location on the substrate using a laser and perform automatic correction of the Z-axis. - Effective for warped substrates such as those after reflow, cracked substrates, and large-sized substrates. - In partial soldering, the height of the jet from the nozzle tip is very important, making it an effective mechanism. #Local Soldering #Partial Soldering
- Company：アルファエレクトロニクス
- Price：Other
